What Is What Is The Difference Between Laser Cutting Machine, Marking Machine And Etching Machine??

Laser cutting machine, marking machine, etching machine are cutting on the workpiece, marking operations, the following we understand their specific content from the principle, classification, workpiece, laser.
Principle:
Laser cutting machine: is the use of focused high power density laser beam irradiation workpiece, so that the irradiated material quickly melted, vaporized, ablated or reached the ignition point, while the molten material is blown away with the help of high-speed airflow coaxial to the beam, so as to achieve the workpiece cut. Laser cutting belongs to one of the thermal cutting methods.
Laser Marking Machine: A high energy continuous laser beam is generated by the laser generator, and the focused laser acts on the substrate material, causing the surface material to melt instantly or even vaporize, and by controlling the path of the laser on the material surface, thus forming the desired graphic mark.
Laser etching machine: The laser uses high energy, very short pulse of laser to vaporize the material instantly, without hurting the surrounding material, and can precisely control the depth of action. Thus, making etching precise.
Laser cutting, marking and etching are all based on the same principle, which is to irradiate the material surface with high energy after beam shaping to cause chemical or physical changes to form cutting, marking pattern text (marking), etching line drawing (scribing).
Classification:
Laser cutting machine:
1、Laser vapor cutting
2、Laser melting cutting
3、Laser oxygen cutting
4、Laser scribing and controlled fracture
Laser marking machine:
1、CO2 laser marking machine
2、Semiconductor laser marking machine
3、Fiber laser marking machine
4, YAG laser marking machine
Laser etching machine:
1, metal film laser etching machine
2, silver paste laser etching machine
3, ITO coating laser etching machine
Workpiece:
Laser cutting machine: usually divided into several types, one is a high power laser metal cutting, such as steel plate, stainless steel plate cutting; one belongs to the micro-precision cutting, such as UV laser cutting PCB, FPC, PI film, etc.; one is CO2 laser cutting leather, cloth and other materials.
Laser marking machine: usually small power laser, can use different light sources, for glass, metal, silicon, plastic and other materials marked with two-dimensional code, patterns, text and other information.
Laser etching machine: usually for photovoltaic, electronics and other industry sectors of conductive materials processing, such as ITO glass etching, solar cell laser scribing and other applications, mainly for processing the formation of line drawings.
Laser different power, frequency above the role of:
1, laser marking machine general 0-50W, can be used to cut 0.01-0.05mm material.
2, laser etching machine basic in about 50-100W.
3, the higher the power of the laser cutting machine, the greater the laser energy, the greater the thickness of the cut.
When we use these machines, according to their workpiece situation to choose the right machine for you.